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Day pass also includes afternoon session:


Packaging: "Digital Health and Semiconductor Technology"

 

Packaging: "The Very Big Picture"

 

Tuesday, July 14
10:00am-12:30pm
Moscone North, Hall E
Room 133                                   

Hosted by:
SEMI Advanced Packaging Committee

 

 Session Sponsor:    KnS logo

 


A big picture look into the future of Semiconductor Packaging Technology

Technology, fueled by innovation and enabled through Moore's Law scaling, is immersing us in a world filled with limitless applications that are fast permeating life across our globe. Semiconductors live at the core of these sophisticated electronics, and are playing a pivotal role in bringing them to market.  

As new waves of technology further evolve, the semiconductor industry is reaching beyond its traditional ecosystem, as it moves to innovate, collaborate, and align with the latest directions and paradigms being carved out by tech giants and game-changers, alike. Indeed, time-to-market increasingly hinges upon deep collaborative and co-development activities that push technologies through boundaries and to new heights. 

This session will deliver 'the very big picture' insight into the innovation, technology, trends, and ecosystems, that are ultimately driving an entire electronics industry to rethink and recalibrate in order to  achieve optimal efficiency across an expanding supply chain and success within increasingly dynamic broad markets. 


 

Agenda

 

10:00am—10:05am     

Session Introduction:
Sesh Ramaswami

Applied Materials (Session Chair)

Dr. William Chen

ASE Group (Session Chair)

 

   
10:05am—10:20am

ITRS 2.0 Packaging Update
Bill Bottoms

3MTS

   
10:20am—11:00am

The Road to Fiji XT

Bryan Black (Biography)
Senior Fellow

AMD

 

 
 

Co-Development in Packaging
 

Calvin Cheung (Biography)

Vice President, Business Development & Engineering
ASE

 
11:00am—11:30am

Development at the System Level

David Douglas
Director of New Technology Development  

Oracle

 
11:30am—12:00pm

Big Picture Systems Managing Big Data
 

Kevin Dasso (Biography)

Pacific Gas and Electric Company

 
12:00pm-12:30pm

Panel Session – “Value vs. Cost”

Moderator: Sesh Ramaswami

Moderator: Dr. William Chen

Panelists:

  • Bill Bottoms, 3MTS
  • Bryan Black, AMD
  • Calvin Cheung, ASE
  • David Douglas, Oracle
  • Kevin Dasso, PG&E

 

Please check back frequently for updates and more information as agendas develop and speakers are announced.

 

 

Registration  

 

For more information about other STS Sessions, Click STS Sessions

 



        By June 5               Starting June 6        
Member (Day Pass)       
  $196   $262
Non Member (Day Pass)
  $262   $349


 

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