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Emerging Generation Memory Technology: Update on 3DNAND, MRAM and RRAM

 

 

Tuesday, July 14
1:30pm - 3:40pm

Session Sponsor: 

Advanced Energy logo

 

Emerging technologies for non-volatile memory are still a small niche business, about $65 million in 2014. But they could grow to a $7 billion market by 2020, as density improves and costs come down, according to Yole Développement’s projections.

 

Major memory suppliers are starting to move 3DNAND into production. Companies have introduced a second-generation of MRAM, which improves density by using spin-transfer torque instead of a magnetic field for switching. ReRAM makers claim to be solving manufacturing issues.

 

We’ve invited the major suppliers to update on the state of these next generation memory technologies, and the challenges for their volume manufacture at competitive cost.

 

Agenda

                                
                                       
1:30pm-2:00pm

Session Keynote: Next Generation Non-Volatile Memory Technology


Naga Chandrasekaran
, Ph.D.
(Biography)
Vice President, Process R&D,
Micron Technology

                          
   

2:00pm-2:20pm
      
Tomorrow's Memories- Ac Cost Game


Jim Handy
(Biography)
Analyst
Objective Analysis
     
2;20pm-2:40pm

Solving Manufacturing Challenges: Spin Torque MRAM on Advanced Technology Nodes

 

Sanjeev Aggarwal, Ph.D (Biography)
Vice President Manufacturing and Process Technology
Everspin

   
2:40pm-3:00pm  

Additive Semiconductor Manufacturing and
Advanced 3D Packaging Enable Early

Adoption of Promising Technologies: ReRAM a
Case in Point

 

Robert Patti (Biography)
CTO and VP of Design Engineering
Tezzaron

   
3:00pm-3:20pm    

Crossbar RRAM– Enabling A New Era Of Storage Innovation

 

Wei D. Lu
, Ph.D. (Biography)
Chief Scientist and Co-founder
Crossbar
 
3:20pm-3:40pm     

Patterning Challenges for Next Generation

High Density Memory

 

Uday Mitra, Ph.D. (Biography)
Ppointed VP, CTO, Etch Business Unit
Applied Materials

   
Session Moderator:

Paula Doe, Ph.D.

SEMI

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